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HY-9055 heat Resistant and thermally conductive silicone compound

Offer type: salePublished: 01.08.2015
Price:negotiated
Company:Shenzhen Hong Ye Jie tehnologiya Co,.Ltd
Seller:Olya
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Address:China, Shenzhen
Product feature
HY-9055 is a two-component additive compound with low viscosity, inherent flame retardant,thermally conductive,may be cured at room temperature and heated temperature .If high temperature then the faster the cure time. It can be applied to electronic components for insulation, waterproofing, fixed ognezashhity composition. It mainly applied in electronic surface components with materials of PC (polycarbonate), PP, ABS, PVC, etc. and metal materials.


Technical parameters
(Note: the above data for this product in 25 ℃ temperature, 55 percent humidity conditions,for reference to accurate data is measured clienty when used.)
Features Part A Part B
Piped drying Exterior color Gray idxt White liquid
Viscosity(25℃cps) 2500±500 2500±500
 
operation features mixing Ratio 1:1
Viscosity(after mixing) (cps) 2000~3000
Working time(25℃ min.) 120
Curing time (Min.25℃) 480
Curing time(80℃ Min.) 20
 
 
After curing Hardness(shore A) 55±5
thermal conductivity [W (m·K)] ≥0.8
Electric strength(KV/mm) ≥25
dielectric permittivity(1.2 MHz) 3.0~3.3
Bulk resistance(Ω·cm) ≥1.0×1016
linear expansion[m/(m·K)] ≤2.2×10-4
fire resistance 94-V1

Technical recommendations
1,a Typical application:
HY 9055 could be applied to
- Powerful electronics,
- DC / DC module and circuit boards, which requires heat dissipation and high temperature resistance.
-It can be broadly used for led screen, wind power generator, PCB substrate, etc. Please put part a and part B in separate container and stir until evenly mixing the two parts together.
2, mixing Ratio: part a: part B = 1:1
3,Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.Then the mixture may be used for the fill.
4 Please note that the thickness of the silicone affects the curing time. If the silicone used is a little thick, then the curing time will be a little longer.Also affects the time of treatment,when at a lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. At a temperature of 80 ~ 100 ℃, the silicone to cure for 15 minutes, whereas in 25 ℃ room temperature silicone velocitymicro 8 hours.
Notes
1. The following material may hinder the curing of HY 9055, so pls use after the test. If necessary, please clean the areas that have been primeneniy.
ORGANOTIN compound or condensation with siliconorganic
Sulphur, sulfide and sulfur rubber materials.
Amine compounds, and also contains the amino acid content.
2. HY 9055 should be sealed.The mixture should be ispolzovaniya so as not to cause waste.
3. HY 9055 belongs to non-dangerous, but keep away from eyes and mouth.
4. When it gets stratified after a period of storage, please mix agoranomoi before using, which does not affect performance.
   
Packaging
20Kg/bucket (part a 20Kg + part B 20Kg)
Shelf life and transportation
1.Twelve (12) months when stored at a temperature of 24 C in the tightly closed original packaging.
2.This product is not a hazardous product that can be transported as General chemicals.
3.Storage for expired doesnot necessarily mean that the product is no longer suitable. However, in this case, the properties required for the intended use must be checked for quality control.


Contacts:
http://www.sellsilicone.ru/
http://www.resinpu.com/index.html
https://www.youtube.com/user/silicon194


Sales Manager:Olga
E-mail:russia@szrl.net
Tel: 0086-755-89212381
Mob.t:0086-18948315814
Skype :silicagel7